High-performance uncooled amorphous silicon TEC less XGA IRFPA with 17μm pixel-pitch
Authors: C. Trouilleau, B. Fièque, S. Noblet, et al.
Published 6 May 2009
A 1024x768 (XGA) IRFPA has been developed with 17μm pixel-pitch to address high end, high performance applications. This detector features: very high image resolution, two video outputs, low power consumption, wide electrical dynamic range, configurable by serial link. The reduction of the pixel-pitch turns this XGA array into a product well adapted for high resolution yet compact systems with excellent NETD coupled with wide thermal dynamic range as well as the outstanding uniformity and high pixel operability, achieved thanks to the use of highly stable amorphous silicon technology coupled with the ROIC design.

Uncooled amorphous silicon TEC-less 1/4 VGA IRFPA with 25 μm pixel-pitch for high volume applications
Authors: Christophe Minassian, Jean Luc Tissot, Michel Vilain, et al.
Published 3 May 2008
The reduction of the pixel-pitch and the innovative package turn this array into a low cost product well adapted for mass production. The paper describes the array’s electro-optical characterization versus environmental temperature.

Uncooled amorphous silicon XGA IRFPA with 17μm pixel-pitch for high end applications
Authors: B. Fieque, P. Robert, C. Minassian, et al.
Published 3 May 2008
Describes the development of 1024 x 768 (XGA) IRFPAs with 17 μm pixel-pitch and all the innovations developed on the full TV format Read Out Integrated Circuit (ROIC) (detector configuration by serial link, two video outputs, low power consumption and wide electrical dynamic range). The specific appeal of this unit lies in the high image resolution it provides. The reduction of the pixel-pitch turns this XGA array into a product well adapted for high resolution and compact systems. The paper highlights the wide thermal dynamic range as well as the high characteristics uniformity and high pixel operability achieved thanks to the mastering of the amorphous silicon technology coupled with the ROIC design.

Latest amorphous silicon microbolometer developments at LETI-LIR
Authors: Jean-Jacques Yon, Eric Mottin, Jean-Luc Tissot
Published 3 May 2008
This paper will first report on the recent developments in microbolometer FPAs. First are discussed significant improvements in 35 μm pitch devices resulting in 11 mK NETD measurements. At the same time, 25 μm pixels have been demonstrated for high performance achievement. The development of a 1024 x 720, 17 μm pitch IRFPA is also described that delivers a very challenging NETD < 40 mK. Finally, a discussion is provided  on the next generation of very low cost Uncooled IRFPA resulting developments on the LETI 8 inches wafer facility.

Innovative on-chip packaging applied to uncooled IRFPA
Authors: Geoffroy Dumont, Agnès Arnaud, Pierre Impérinetti, et al.
Published 17 April 2008
The Laboratoire Infrarouge (LIR) of the Laboratoire d'Electronique et de Technologie de l'Information (LETI) has been involved in the development of microbolometers for over fifteen years. Two generations of technology have been transferred to ULIS and LETI is still working to improve performances of low cost detectors. Simultaneously, packaging still represents a significant part of detectors price. Reducing production costs would contribute to keep on extending applications of uncooled IRFPA to high volume markets like automotive. Therefore LETI is developing an on-chip packaging technology dedicated to microbolometers. This paper presents an original microcap structure that enables the use of IR window materials as sealing layers to maintain the expected vacuum level. The modelling and integration of an IR window suitable for this structure is also presented. This monolithic packaging technology is performed in a standard collective way, in continuation of bolometer technology.

Uncooled detector development for space application
Authors: W. Rabaud, M. Vilain, J. Meilhan, et al.
Published 15 April 2008
The European Space Agency (ESA) has committed to a multi-spacecraft Cornerstone mission to the planet Mercury. BepiColombo comprises two spacecraft, one of which (the Mercury Planetary Orbiter platform (MPO)) will contain remote sensing instruments for making measurements of the planet at wavelengths from the far infrared to γ-rays. The MERcury Thermal Infrared Spectrometer (MERTIS) measures spectral emittance from Mercury in the range from 7 to 14 μm to derive surface mineralogy. It will employ an uncooled IR focal plane array (IRFPA) at the heart of the spectrometer. Within this framework, the IRFPA has been developed made from amorphous silicon which yields a short thermal time constant as well as very low NETD. Specific attention has been paid to the fact that such detector has to operate in space environment. The paper will present the specific development under progress and the first results obtained to fulfil the MERTIS requirements in terms of performance, irradiative and mechanical environments.

High resolution images obtained with uncooled microbolometer
Authors: J. Sadi, A. Crastes
Published 11 April 2008
This study presents experimental results of a resolution enhancement algorithm used in the physical world without any microscan optomechanical element. The HR (High Resolution) software developed by Lightnics was used together with an uncooled microbolometer array from Ulis, with low thermal time constant. It takes advantage of the relative motion between camera and object to produce information redundancy through a set of captured images giving rise to one increased resolution image. Enhanced images from a bar target show better MTF and MRTD curves after HR software processing than before. In addition, lower spatial and temporal noises were obtained as an additional benefit of the algorithm.